Samsung, SK hynix to build HBM packaging fabs in Chungcheong region as part of 392 tln won in total investment

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Samsung and SK Hynix plan to build HBM (High Bandwidth Memory) packaging fabrication plants in South Korea’s Chungcheong region as part of a 392 trillion won ($252.5 billion) total investment in the semiconductor industry. This significant industry investment seeks to expand domestic chip manufacturing capabilities.

SEOUL, July 2 (Yonhap) -- An industrywide 392 trillion-won (US$252.5 billion) in...