ASML eyes hybrid bonding, report finds, as Chinese firms adopt chip packaging technique

AI Summary

ASML is reportedly expanding its work on hybrid bonding, a chip-packaging technique that connects chips or silicon wafers directly to create dense electrical links. Chinese companies are also adopting the technology to improve chip performance.

Dutch semiconductor equipment giant ASML is expanding into next-generation hybrid bonding, a technique that creates dense electrical connections by directly joining chips or silicon wafers, according to a new report. Major Chinese companies are also adopting the technology to improve chip performance. ASML submitted 27 patent families related to hybrid bonding tools between December 2022 and November 2024, according to a report published by semiconductor and AI supply chain research firm...